RoHSIEC
Flux Paste
Sengura flux paste is formulated for excellent wetting and reliable solder joint formation. The low-residue formulation is specifically designed for precision electronics assembly, ensuring clean joints with minimal post-soldering cleanup. Compatible with both lead-free and leaded solder alloys.
Contact SalesSpecifications
Product NameFlux Paste
TypeRosin-based flux paste
FormulationLow-residue, low-activation
ApplicationPrecision electronics assembly
StandardsRoHS, IEC
Features
- ✓Excellent wetting for reliable joint formation
- ✓Low residue formulation reduces cleanup requirements
- ✓Low-activation formula for safe working environment
- ✓Compatible with lead-free and leaded solder alloys
- ✓Suitable for precision component placement
Applications
1PCB assembly and surface mount technology
2Precision electronics manufacturing
3Fine-pitch component soldering
4Robotics and automated assembly lines
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